Modem IP Cores & Dev Kits
1 Gbps FDD modem FPGA IP core and development kit
1 GBPS FDD MODEM IP CORE
Characteristics
- Optimized for low cost Xilinx Artix-7 FPGA
- Reference modem board available
- Integration with SiGe RFICs from Hittite and Infineon (60/70/80 GHz)
- Field proven design (2 products on the market)
Parameters
- Max throughput: 1.25 Gbps
- Min throughput: 0.25 Gbps
- Bandwidth: 700 MHz
- Modulation format: SC-FDE
- Modulation levels: BPSK/QPSK/16QAM
- FEC: Low Density Parity Check
- Advanced RF impairments compensation
- Latency: < 15 us
Deliverables
- Verilog IP (source code or netlist)
- Modem simulator: floating-point simulator in Matlab/C and bit-accurate fixed point simulator in C
- Synthesis scripts and Vivado project files
- Control and drivers software (source codes, binaries and makefiles)
Modem block-diagram
MODEM BOARD RGM-M-C03
Characteristics
- Full featured hardware platform for point-to-point mm-Wave links
- Support of the 1 Gbps FDD modem IP core
- Reference Linux-based software stack for a Microblaze CPU
- Xilinx Artix-7 FPGA
- Integrated L2+ Ethernet switch (VLAN, QoS, OAM)
- Network synchronization: SyncE and IEEE 1588v2 (BC, TC)
- CLI, Web, and SNMP management interfaces
Parameters
- Dimensions: 190 mm x 190 mmx 20 mm
- LAN interface: 2xRJ45 and 2xSFP
- Analog interface: RF connector (DF40)
- Temperature range: -45 C…+60 C
Modem board block-diagram
RGM-M-C03 board
DEVELOPMENT KIT RGM-DK-C03
Characteristics
- Design kit includes a modem board RGM-M-C03 with an additional enclosure and an interface PCB
- Enclosure with a heatsink is required for heat dissipation from the modem board under its operation
- Interface PCB allows modifying custom RF interface of the modem board to the standard coaxial connectors (MCX-type) for TX and RX I/Q